• Communications: Circuits for High speed wireline communication over copper and fiber optic cables
• Memories: Low-power and reliable Memories and Deep-subthreshold Sense Amplifier Circuits
• Machine Learning: Mixed-signal circuits for energy efficient computing for deep learning accelerators
• CMOS-Photonic Intagration: Die-to-Die CMOS-Photonic interfaces
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[J5] B. Radi, Z. Li, D. Patel and A. C. Carusone, "Optimizing the Photodetector/Analog Front-end Interface in Optical Communication Receivers," in IEEE Transactions on Signal and Power Integrity, 2023, vol. 2, pp. 111-121, Aug. 2023 [PDF] [IEEExplore Link]
[J4] D. Patel, A. Sharif-Bakhtiar and A. C. Carusone, "A 112 Gb/s -8.2 dBm Sensitivity 4-PAM Linear TIA in 16nm CMOS with Co-Packaged Photodiodes," in IEEE Journal of Solid-State Circuits (JSSC), vol. 58, no. 3, pp. 771-784, March 2023. [Invited Paper from CICC'22] [PDF] [IEEExplore Link]
[J3] D. Patel, A. Neale, D. Wright and M. Sachdev, "Body Biased Sense Amplifier with Auto-Offset Mitigation for Low-Voltage SRAMs," in IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 68, no. 8, pp. 3265-3278, Aug. 2021. [PDF] [IEEExplore Link]
[J2] D. Patel, A. Neale, D. Wright and M. Sachdev, "Hybrid Latch-Type Offset Tolerant Sense Amplifier for Low-Voltage SRAMs," in IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 66, no. 7, pp. 2519-2532, July 2019. [PDF] [IEEExplore Link]
[J1] D. Patel and M. Sachdev, "0.23-V Sample-Boost-Latch-Based Offset Tolerant Sense Amplifier," in IEEE Solid-State Circuits Letters (SSC-L), vol. 1, no. 1, pp. 6-9, Jan. 2018. [PDF] [IEEExplore Link]
[C4] D. Patel, B. Radi, A. Sharif-Bakhtiar and A. C. Carusone, "Experimental Study of the Equalization Requirements of a 2.5D Co-Packaged 16-nm CMOS Optical Receiver up to 160 Gb/s," in 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022, pp. 1-4. [PDF] [IEEExplore Link]
[C3] D. Patel, A. Sharif-Bakhtiar and A. C. Carusone, "A 112 Gb/s -8.2 dBm Sensitivity 4-PAM Linear TIA in 16nm CMOS with Co-Packaged Photodiodes," in 2022 IEEE Custom Integrated Circuits Conference (CICC), 2022, pp. 1-2, Newport Beach, CA, USA. (Outstanding Student Paper Award) [PDF] [IEEExplore Link]
[C2] D. Patel, D. Wright and M. Sachdev, "Sense amplifier offset characterisation and test implications for low-voltage SRAMs in 65 nm," in 2018 IEEE 23rd European Test Symposium (ETS), Bremen, 2018, pp. 1-6. [PDF] [Slides] [IEEExplore Link]
[C1] D. Patel and M. Sachdev, "Sample-Boost-Latch Based Offset Tolerant Sense Amplifier for Sub-threshold SRAMs" IEEE 2018 International Solid-State Circuits Conference (ISSCC) Student Research Preview, San Francisco, California. [Poster] [Slides] [Research Gate Link]
• Designing Optical Receiver Front-end for +100 Gb/s PAM-4 fiber-optic communications in 16 nm FinFet CMOS
• Providing compact package level integration solution of CMOS optical receiver with state-of-the-art photodetectors
• High-frequency and Low-noise layout optimization in 16 nm FinFet CMOS
• Second order system optimization with Gain-BW-Noise trade-offs and peak-distortion analysis
• Taped-out low-voltage and offset reducing Sense-amplifiers in 65 nm CMOS
• Researched variation tolerant, low-voltage, short-sensing delay sense amplifiers for SRAMs
• PCB Design for Sense Amplifier IC characterization
• Characterization of 65-nm Sense Amplifier ICs in VLSI laboratory
• Assisted in In-Vehicular DC power-line communication (PLC) research
• Schematics and PCB designs of transmitter and receiver analog-front-end (AFE) boards
• Prototyped and characterized AFE transceivers in microelectronics laboratory
• Performed substantial circuit simulations and component selections for the AFE circuitry